Leidos
Saint Petersburg, Florida
Job Description Description The Defense Systems Group at Leidos has an immediate opening for a Principal Digital Firmware Design Engineer at our St. Petersburg, FL facility. This position supports the development of advanced, mission-critical military communications systems and involves the design, integration, testing, and optimization of secure, ruggedized electronic hardware and firmware for defense applications. The ideal candidate will possess deep expertise in FPGA-based digital design and hands-on experience with integrating hardware and firmware within complex embedded systems. This individual will have a demonstrated track record supporting defense programs across the full product lifecycle-from requirements development and architectural design through integration, qualification testing, and transition to production. The Leidos St. Petersburg facility specializes in the design, development, modeling and simulation, analysis, prototyping, and testing of advanced electronic systems. Our primary focus areas include embedded communications systems, Software Defined Radios (SDR), and Phased Array Antenna Systems supporting Department of Defense and commercial customers. Primary Responsibilities: Participate in a multi-disciplinary engineering team developing secure, high-performance military communications hardware and firmware. Analyze and decompose system-level requirements into detailed hardware design specifications with full traceability. Perform Logic Design; write VHDL code, perform synthesis, logic simulation, test bench generation, functional testing and hardware debugging of designs within FPGA/CPLD devices. Architect, implement and test embedded firmware /software within FPGA-based digital designs including signal processing, control logic, and high-speed interfaces on a variety of platforms (FPGAs, microcontrollers, microprocessors, and mixed signal designs). Troubleshoot and resolve complex hardware, firmware / software and integration issues across prototype and production phases. Support design reviews (SRR, PDR, CDR), technical documentation, and configuration management processes. Provide technical input for cost estimates, schedules, and risk assessments. Collaborate closely with Firmware, Software, RF, systems, and test engineering teams throughout the development lifecycle. Clearance Requirements: U.S. Citizen required. Ability to obtain and maintain a Secret Security Clearance. Active Secret clearance preferred. Ability to obtain Top Secret clearance preferred. Required Qualifications: BS or MS in Electrical Engineering, Computer Engineering, or related field. 8+ years of experience in embedded hardware and digital design (10+ preferred for Senior level). Experience supporting full product development lifecycle including: Requirements analysis, System design and hardware implementation, Integration and test Firmware/software architecture development for embedded systems, including FPGAs and SoCs Technical documentation and formal design reviews Strong VHDL, FPGA/SoC design and implementation experience: Digital logic design using VHDL/Verilog with System-On-Chip devices (SoC's), FPGA's, CPLD/s, and/or Microcontrollers. Modern vendor design tools (IDE's) such as Xilinx Vivado, Vitis, STM, Libero SoC, Lattice Diamond Simulation and Testbench generation (Xilinx simulator, Aldec Active HDL, Riveria Pro, Modelsim, or similar) RISC microprocessors architectures (ARM Cortex, Microblaze, PowerPC, RISC-V) C/C++ language software development for embedded, real-time systems. Experience with one or more of the following: Integrating and troubleshooting digital subsystems within embedded systems. Digital interfaces such as I2C, SPI, RS-232/422, USB, Ethernet ADC/DAC devices and understanding performance characteristics. Hands-on lab experience debugging hardware using oscilloscopes, logic analyzers, and related tools Understand trade-offs of embedded system targets (FPGA, SoC, microcontroller, RTOS, bare-metal) for developing best cost/option architectures Preferred Qualifications: Active Secret or Top Secret clearance. Proven experience in full-stack FPGA development for Xilinx UltraScale/UltraScale+ architectures, spanning RTL design (VHDL/Verilog) and embedded C/C++ development for bare-metal, FreeRTOS, or embedded Linux environments (PetaLinux, etc). Experience with one or more of the following: Design and development with other FPGA/CPLD vendors such as Microsemi, ST-Micro, Lattice, etc High-speed interfaces/protocols such as PCIe, JESD204B, LVDS, and SERDES Simulation and modeling tools (MATLAB, Python, LabVIEW) Implementing signal processing concepts such as digital filters, digital modulation, up/down conversion within HDL designs IP cores and modern processor interfaces (Xilinx IP Cores, AXI4, AXI-Stream or similar) Design, integration and testing electronic circuits within embedded systems, including digital, analog and radio frequency (RF) subsystems. Experience developing ruggedized or military communication systems Experience with the Cooperative Engagement Capability Naval communications system. Experience transitioning prototype designs into production hardware Familiar with schematic capture design tools (Altium, Cadence Allegro/OrCAD, Ki-CAD or equivalent) If you're looking for comfort, keep scrolling. At Leidos, we outthink, outbuild, and outpace the status quo - because the mission demands it. We're not hiring followers. We're recruiting the ones who disrupt, provoke, and refuse to fail. Step 10 is ancient history. We're already at step 30 - and moving faster than anyone else dares. Original Posting:October 27, 2026 For U.S. Positions: While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above. Pay Range:Pay Range $107,900.00 - $195,050.00 The Leidos pay range for this job level is a general guideline only and not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law. About Leidos Leidos is an industry and technology leader serving government and commercial customers with smarter, more efficient digital and mission innovations. Headquartered in Reston, Virginia, with 47,000 global employees, Leidos reported annual revenues of approximately $16.7 billion for the fiscal year ended January 3, 2025. For more information, visit . Pay and Benefits Pay and benefits are fundamental to any career decision. That's why we craft compensation packages that reflect the importance of the work we do for our customers. Employment benefits include competitive compensation, Health and Wellness programs, Income Protection, Paid Leave and Retirement. More details are available at -benefits. Securing Your Data Beware of fake employment opportunities using Leidos' name. Leidos will never ask you to provide payment-related information during any part of the employment application process (i.e., ask you for money), nor will Leidos ever advance money as part of the hiring process (i.e., send you a check or money order before doing any work). Further, Leidos will only communicate with you through emails that are generated by the automated system - never from free commercial services (e.g., Gmail, Yahoo, Hotmail) or via WhatsApp, Telegram, etc. If you received an email purporting to be from Leidos that asks for payment-related information or any other personal information (e.g., about you or your previous employer), and you are concerned about its legitimacy, please make us aware immediately by emailing us at . If you believe you are the victim of a scam, contact your local law enforcement and report the incident to the U.S. Federal Trade Commission. Commitment to Non-Discrimination All qualified applicants will receive consideration for employment without regard to sex, race, ethnicity, age, national origin, citizenship, religion, physical or mental disability, medical condition, genetic information, pregnancy, family structure, marital status, ancestry, domestic partner status, sexual orientation, gender identity or expression, veteran or military status, or any other basis prohibited by law. Leidos will also consider for employment qualified applicants with criminal histories consistent with relevant laws.
Job Description Description The Defense Systems Group at Leidos has an immediate opening for a Principal Digital Firmware Design Engineer at our St. Petersburg, FL facility. This position supports the development of advanced, mission-critical military communications systems and involves the design, integration, testing, and optimization of secure, ruggedized electronic hardware and firmware for defense applications. The ideal candidate will possess deep expertise in FPGA-based digital design and hands-on experience with integrating hardware and firmware within complex embedded systems. This individual will have a demonstrated track record supporting defense programs across the full product lifecycle-from requirements development and architectural design through integration, qualification testing, and transition to production. The Leidos St. Petersburg facility specializes in the design, development, modeling and simulation, analysis, prototyping, and testing of advanced electronic systems. Our primary focus areas include embedded communications systems, Software Defined Radios (SDR), and Phased Array Antenna Systems supporting Department of Defense and commercial customers. Primary Responsibilities: Participate in a multi-disciplinary engineering team developing secure, high-performance military communications hardware and firmware. Analyze and decompose system-level requirements into detailed hardware design specifications with full traceability. Perform Logic Design; write VHDL code, perform synthesis, logic simulation, test bench generation, functional testing and hardware debugging of designs within FPGA/CPLD devices. Architect, implement and test embedded firmware /software within FPGA-based digital designs including signal processing, control logic, and high-speed interfaces on a variety of platforms (FPGAs, microcontrollers, microprocessors, and mixed signal designs). Troubleshoot and resolve complex hardware, firmware / software and integration issues across prototype and production phases. Support design reviews (SRR, PDR, CDR), technical documentation, and configuration management processes. Provide technical input for cost estimates, schedules, and risk assessments. Collaborate closely with Firmware, Software, RF, systems, and test engineering teams throughout the development lifecycle. Clearance Requirements: U.S. Citizen required. Ability to obtain and maintain a Secret Security Clearance. Active Secret clearance preferred. Ability to obtain Top Secret clearance preferred. Required Qualifications: BS or MS in Electrical Engineering, Computer Engineering, or related field. 8+ years of experience in embedded hardware and digital design (10+ preferred for Senior level). Experience supporting full product development lifecycle including: Requirements analysis, System design and hardware implementation, Integration and test Firmware/software architecture development for embedded systems, including FPGAs and SoCs Technical documentation and formal design reviews Strong VHDL, FPGA/SoC design and implementation experience: Digital logic design using VHDL/Verilog with System-On-Chip devices (SoC's), FPGA's, CPLD/s, and/or Microcontrollers. Modern vendor design tools (IDE's) such as Xilinx Vivado, Vitis, STM, Libero SoC, Lattice Diamond Simulation and Testbench generation (Xilinx simulator, Aldec Active HDL, Riveria Pro, Modelsim, or similar) RISC microprocessors architectures (ARM Cortex, Microblaze, PowerPC, RISC-V) C/C++ language software development for embedded, real-time systems. Experience with one or more of the following: Integrating and troubleshooting digital subsystems within embedded systems. Digital interfaces such as I2C, SPI, RS-232/422, USB, Ethernet ADC/DAC devices and understanding performance characteristics. Hands-on lab experience debugging hardware using oscilloscopes, logic analyzers, and related tools Understand trade-offs of embedded system targets (FPGA, SoC, microcontroller, RTOS, bare-metal) for developing best cost/option architectures Preferred Qualifications: Active Secret or Top Secret clearance. Proven experience in full-stack FPGA development for Xilinx UltraScale/UltraScale+ architectures, spanning RTL design (VHDL/Verilog) and embedded C/C++ development for bare-metal, FreeRTOS, or embedded Linux environments (PetaLinux, etc). Experience with one or more of the following: Design and development with other FPGA/CPLD vendors such as Microsemi, ST-Micro, Lattice, etc High-speed interfaces/protocols such as PCIe, JESD204B, LVDS, and SERDES Simulation and modeling tools (MATLAB, Python, LabVIEW) Implementing signal processing concepts such as digital filters, digital modulation, up/down conversion within HDL designs IP cores and modern processor interfaces (Xilinx IP Cores, AXI4, AXI-Stream or similar) Design, integration and testing electronic circuits within embedded systems, including digital, analog and radio frequency (RF) subsystems. Experience developing ruggedized or military communication systems Experience with the Cooperative Engagement Capability Naval communications system. Experience transitioning prototype designs into production hardware Familiar with schematic capture design tools (Altium, Cadence Allegro/OrCAD, Ki-CAD or equivalent) If you're looking for comfort, keep scrolling. At Leidos, we outthink, outbuild, and outpace the status quo - because the mission demands it. We're not hiring followers. We're recruiting the ones who disrupt, provoke, and refuse to fail. Step 10 is ancient history. We're already at step 30 - and moving faster than anyone else dares. Original Posting:October 27, 2026 For U.S. Positions: While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above. Pay Range:Pay Range $107,900.00 - $195,050.00 The Leidos pay range for this job level is a general guideline only and not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law. About Leidos Leidos is an industry and technology leader serving government and commercial customers with smarter, more efficient digital and mission innovations. Headquartered in Reston, Virginia, with 47,000 global employees, Leidos reported annual revenues of approximately $16.7 billion for the fiscal year ended January 3, 2025. For more information, visit . Pay and Benefits Pay and benefits are fundamental to any career decision. That's why we craft compensation packages that reflect the importance of the work we do for our customers. Employment benefits include competitive compensation, Health and Wellness programs, Income Protection, Paid Leave and Retirement. More details are available at -benefits. Securing Your Data Beware of fake employment opportunities using Leidos' name. Leidos will never ask you to provide payment-related information during any part of the employment application process (i.e., ask you for money), nor will Leidos ever advance money as part of the hiring process (i.e., send you a check or money order before doing any work). Further, Leidos will only communicate with you through emails that are generated by the automated system - never from free commercial services (e.g., Gmail, Yahoo, Hotmail) or via WhatsApp, Telegram, etc. If you received an email purporting to be from Leidos that asks for payment-related information or any other personal information (e.g., about you or your previous employer), and you are concerned about its legitimacy, please make us aware immediately by emailing us at . If you believe you are the victim of a scam, contact your local law enforcement and report the incident to the U.S. Federal Trade Commission. Commitment to Non-Discrimination All qualified applicants will receive consideration for employment without regard to sex, race, ethnicity, age, national origin, citizenship, religion, physical or mental disability, medical condition, genetic information, pregnancy, family structure, marital status, ancestry, domestic partner status, sexual orientation, gender identity or expression, veteran or military status, or any other basis prohibited by law. Leidos will also consider for employment qualified applicants with criminal histories consistent with relevant laws.
Axiom Path
Lexington, North Carolina
Job Description Job Description Be Part Of A High-Performing Team Join a global climate technology organization developing advanced thermal solutions for high-density data centers and the broader semiconductor ecosystem. This team operates at the intersection of mechanical engineering, liquid cooling, controls, system integration, and product commercialization. The organization is expanding its data center capabilities to support next-generation computing environments with reliable, scalable, and energy-efficient cooling architectures. Team members collaborate with engineering leaders, product teams, customers, consultants, and industry organizations to transform emerging technologies into practical commercial solutions. This opportunity is designed for an experienced data center thermal professional who can bring immediate technical credibility, influence system direction, and communicate effectively with customers and senior stakeholders. What's In Store For You A highly visible role supporting advanced data center cooling initiatives The opportunity to influence next-generation liquid cooling architectures Remote flexibility for highly qualified candidates Collaboration with senior engineering, product, commercial, and customer teams Participation in industry associations, technical committees, conferences, and standards development Exposure to system design, simulation, validation, commissioning, and commercialization Opportunities to mentor technical professionals and shape long-term engineering strategy Comprehensive health, retirement, family-building, educational, wellness, and paid-time-off programs Travel support for qualified candidates attending onsite interviews in Davidson, North Carolina How You Will Make An Impact Serve as a subject matter expert for advanced data center thermal management and liquid cooling systems. Develop integrated cooling concepts spanning chips, racks, coolant distribution units, facility water systems, controls, and heat rejection. Evaluate system architectures, equipment capabilities, operating modes, control strategies, and performance tradeoffs. Perform or guide thermal analysis, computational fluid dynamics, modeling, simulation, and equipment evaluation. Develop system documentation, piping concepts, mode tables, control requirements, and sequences of operation. Support system validation through digital analysis, laboratory testing, commissioning, and field evaluation. Collaborate with product teams, technical specialists, consultants, customers, and commercial leaders. Provide technical guidance during strategic customer pursuits and system commercialization efforts. Deliver technical presentations to customers, leadership teams, sales organizations, and industry audiences. Participate in organizations such as ASHRAE, the Open Compute Project, IEEE, or other relevant standards groups. Translate emerging cooling technologies into reliable, scalable, and market-ready solutions. Do You Have the Expertise to Lead in Data Center Thermal Systems? Bachelor's degree in mechanical engineering, thermal sciences, controls engineering, or a closely related discipline. At least eight years of relevant engineering, system integration, or technical product experience. Direct professional experience supporting data centers, mission-critical facilities, or data center cooling products. Demonstrated experience with liquid cooling technologies such as direct-to-chip cooling, immersion cooling, coolant distribution units, or facility water systems. Strong understanding of thermal-fluid systems, HVAC equipment, cooling infrastructure, controls, and heat rejection. Ability to evaluate complete thermal management systems rather than individual components. Experience with CFD, ANSYS, thermal modeling, fluid modeling, or system simulation is strongly preferred. Absorption cooling experience is highly valued. Experience developing system modes, control requirements, or sequences of operation is preferred. Commissioning, field validation, troubleshooting, or facility integration experience is strongly valued. Strong customer-facing, presentation, written, and verbal communication skills. Ability to explain complex technical topics clearly to both engineering and business audiences. Experience influencing technical direction across multiple teams and stakeholders. Professional Engineer licensure, advanced technical education, or industry committee participation is beneficial but not required. Willingness to travel domestically and internationally as needed.
Job Description Job Description Be Part Of A High-Performing Team Join a global climate technology organization developing advanced thermal solutions for high-density data centers and the broader semiconductor ecosystem. This team operates at the intersection of mechanical engineering, liquid cooling, controls, system integration, and product commercialization. The organization is expanding its data center capabilities to support next-generation computing environments with reliable, scalable, and energy-efficient cooling architectures. Team members collaborate with engineering leaders, product teams, customers, consultants, and industry organizations to transform emerging technologies into practical commercial solutions. This opportunity is designed for an experienced data center thermal professional who can bring immediate technical credibility, influence system direction, and communicate effectively with customers and senior stakeholders. What's In Store For You A highly visible role supporting advanced data center cooling initiatives The opportunity to influence next-generation liquid cooling architectures Remote flexibility for highly qualified candidates Collaboration with senior engineering, product, commercial, and customer teams Participation in industry associations, technical committees, conferences, and standards development Exposure to system design, simulation, validation, commissioning, and commercialization Opportunities to mentor technical professionals and shape long-term engineering strategy Comprehensive health, retirement, family-building, educational, wellness, and paid-time-off programs Travel support for qualified candidates attending onsite interviews in Davidson, North Carolina How You Will Make An Impact Serve as a subject matter expert for advanced data center thermal management and liquid cooling systems. Develop integrated cooling concepts spanning chips, racks, coolant distribution units, facility water systems, controls, and heat rejection. Evaluate system architectures, equipment capabilities, operating modes, control strategies, and performance tradeoffs. Perform or guide thermal analysis, computational fluid dynamics, modeling, simulation, and equipment evaluation. Develop system documentation, piping concepts, mode tables, control requirements, and sequences of operation. Support system validation through digital analysis, laboratory testing, commissioning, and field evaluation. Collaborate with product teams, technical specialists, consultants, customers, and commercial leaders. Provide technical guidance during strategic customer pursuits and system commercialization efforts. Deliver technical presentations to customers, leadership teams, sales organizations, and industry audiences. Participate in organizations such as ASHRAE, the Open Compute Project, IEEE, or other relevant standards groups. Translate emerging cooling technologies into reliable, scalable, and market-ready solutions. Do You Have the Expertise to Lead in Data Center Thermal Systems? Bachelor's degree in mechanical engineering, thermal sciences, controls engineering, or a closely related discipline. At least eight years of relevant engineering, system integration, or technical product experience. Direct professional experience supporting data centers, mission-critical facilities, or data center cooling products. Demonstrated experience with liquid cooling technologies such as direct-to-chip cooling, immersion cooling, coolant distribution units, or facility water systems. Strong understanding of thermal-fluid systems, HVAC equipment, cooling infrastructure, controls, and heat rejection. Ability to evaluate complete thermal management systems rather than individual components. Experience with CFD, ANSYS, thermal modeling, fluid modeling, or system simulation is strongly preferred. Absorption cooling experience is highly valued. Experience developing system modes, control requirements, or sequences of operation is preferred. Commissioning, field validation, troubleshooting, or facility integration experience is strongly valued. Strong customer-facing, presentation, written, and verbal communication skills. Ability to explain complex technical topics clearly to both engineering and business audiences. Experience influencing technical direction across multiple teams and stakeholders. Professional Engineer licensure, advanced technical education, or industry committee participation is beneficial but not required. Willingness to travel domestically and internationally as needed.
Transparent Search Group
Boston, Massachusetts
Job Description Job Description Principal Analog/Mixed Signal Engineer Company: Extropic Location: Boston, MA (hybrid, 3 days in office) Compensation: $200,000 - $325,000 + competitive equity Employment Type: Full-time Visa Sponsorship: Visa transfers and new sponsorship (H-1B, TN) About Extropic Extropic is building thermodynamic computing, a new compute paradigm that uses thermal noise in CMOS devices to perform probabilistic computation with radical power efficiency (potentially 10,000x savings over traditional approaches). Its founders, former Google Quantum Computing researchers, spent years fighting thermal noise before realizing they could harness it. Founded in 2022, Extropic has about 30 people, has taped out its third chip (Z1) and is defining the architecture for three more. It has raised a $14.1M seed. The Role Extropic is hiring a Principal Analog/Mixed Signal Engineer (6+ years) to lead the design of next-generation thermodynamic computing chips. This is a ground-floor chance to own major pieces of chip design, and potentially serve as design lead for one of three planned chips, at a company positioned to reshape AI acceleration and edge computing. What You Will Do Lead design of analog and mixed-signal blocks: ADCs, PLLs, bandgaps, regulators, high-speed SerDes, oscillators and dividers. Own large parts of chip architecture, potentially as design lead for an upcoming chip. Do hands-on layout and design verification (DRC, ERC, LVS). Work across IC, systems, physics and algorithms teams to turn probabilistic computing concepts into silicon. Test and validate fabricated chips in the lab with signal generators, spectrum analyzers and oscilloscopes. What You Bring 6+ years of analog/mixed-signal IC design Block design experience (ADCs, PLLs, SerDes, bandgaps, regulators) Hands-on layout and verification (DRC, ERC, LVS) in Cadence CMOS and FinFET process experience Lab bring-up and validation skills Ability to work hybrid 3 days a week in Boston Tech Stack CMOS, Cadence, FinFET, PLL, ADC, SerDes, Python, C
Job Description Job Description Principal Analog/Mixed Signal Engineer Company: Extropic Location: Boston, MA (hybrid, 3 days in office) Compensation: $200,000 - $325,000 + competitive equity Employment Type: Full-time Visa Sponsorship: Visa transfers and new sponsorship (H-1B, TN) About Extropic Extropic is building thermodynamic computing, a new compute paradigm that uses thermal noise in CMOS devices to perform probabilistic computation with radical power efficiency (potentially 10,000x savings over traditional approaches). Its founders, former Google Quantum Computing researchers, spent years fighting thermal noise before realizing they could harness it. Founded in 2022, Extropic has about 30 people, has taped out its third chip (Z1) and is defining the architecture for three more. It has raised a $14.1M seed. The Role Extropic is hiring a Principal Analog/Mixed Signal Engineer (6+ years) to lead the design of next-generation thermodynamic computing chips. This is a ground-floor chance to own major pieces of chip design, and potentially serve as design lead for one of three planned chips, at a company positioned to reshape AI acceleration and edge computing. What You Will Do Lead design of analog and mixed-signal blocks: ADCs, PLLs, bandgaps, regulators, high-speed SerDes, oscillators and dividers. Own large parts of chip architecture, potentially as design lead for an upcoming chip. Do hands-on layout and design verification (DRC, ERC, LVS). Work across IC, systems, physics and algorithms teams to turn probabilistic computing concepts into silicon. Test and validate fabricated chips in the lab with signal generators, spectrum analyzers and oscilloscopes. What You Bring 6+ years of analog/mixed-signal IC design Block design experience (ADCs, PLLs, SerDes, bandgaps, regulators) Hands-on layout and verification (DRC, ERC, LVS) in Cadence CMOS and FinFET process experience Lab bring-up and validation skills Ability to work hybrid 3 days a week in Boston Tech Stack CMOS, Cadence, FinFET, PLL, ADC, SerDes, Python, C
