8 jobs found

Job Description Job Description Principal Analog/Mixed Signal Engineer Company: Confidential - venture-backed technology company Location: Boston, MA (hybrid, 3 days in office) Compensation: $200,000 - $325,000 + competitive equity Employment Type: Full-time Visa Sponsorship: Visa transfers and new sponsorship (H-1B, TN) About the Company The client is building thermodynamic computing, a new compute paradigm that uses thermal noise in CMOS devices to perform probabilistic computation with radical power efficiency (potentially 10,000x savings over traditional approaches). Its founders, former Google Quantum Computing researchers, spent years fighting thermal noise before realizing they could harness it. Founded in 2022, the client has about 30 people, has taped out its third chip (Z1) and is defining the architecture for three more. It has raised a $14.1M seed. The Role The client is hiring a Principal Analog/Mixed Signal Engineer (6+ years) to lead the design of next-generation thermodynamic computing chips. This is a ground-floor chance to own major pieces of chip design, and potentially serve as design lead for one of three planned chips, at a company positioned to reshape AI acceleration and edge computing. What You Will Do Lead design of analog and mixed-signal blocks: ADCs, PLLs, bandgaps, regulators, high-speed SerDes, oscillators and dividers. Own large parts of chip architecture, potentially as design lead for an upcoming chip. Do hands-on layout and design verification (DRC, ERC, LVS). Work across IC, systems, physics and algorithms teams to turn probabilistic computing concepts into silicon. Test and validate fabricated chips in the lab with signal generators, spectrum analyzers and oscilloscopes. What You Bring 6+ years of analog/mixed-signal IC design Block design experience (ADCs, PLLs, SerDes, bandgaps, regulators) Hands-on layout and verification (DRC, ERC, LVS) in Cadence CMOS and FinFET process experience Lab bring-up and validation skills Ability to work hybrid 3 days a week in Boston Tech Stack CMOS, Cadence, FinFET, PLL, ADC, SerDes, Python, C Before you apply: get a free recruiter-readiness score for your resume at CareerStanding - about a minute, no signup, and your resume stays in your browser.

Job Description Job Description Company Description Renesas Electronics Americas (REA) is a dynamic, multi-cultural tech company where employees can learn, mentor and thrive. REA brings together the strong financial foundation of a multi-billion-dollar global operation and the flexibility and velocity of a smaller organization. We are developing technologies for the latest advances in mobile computing, secured connected devices, autonomous driving, smart homes and factories and more. Our solutions are at the heart of products developed by the major innovators around the world. Join us and be part of what's next in electronics. Job Description Our Hi-Rel Space Product and Test Engineering Group is seeking a talented Test Engineer to join our team in our Palm Bay, FL, office. Our team develops Radiation-Hardened ICs for the Space Industry. You will work with a team primarily co-located in Palm Bay, with an on-site production test floor. Responsibilities include developing test methodologies, defining test schematics, PCB layouts, and hardware; developing and debugging test programs; correlating production test solutions to bench measurements; and transferring test solutions to production. Primary Responsibilities: Define Test Requirements for new ICs in Conjunction with the Development Team Write Characterization programs Develop production test programs Design Load Boards for Automated Test Equipment Perform GR&R studies and Transient Analysis, aka Spike Check, aka de-glitch Qualifications BSEE with 12+ years of experience creating test solutions for an automated test environment in the semiconductor industry Previous work on Analog, Mixed Signal, and Power ICs (such as LDOs, Buck Regulators, PMIC, PWM Controller) In-depth experience with 93k, Cohu DiamondX, ETS364, or Teradyne microFLEX preferred Additional Information Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives. We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Are you ready to join our team and shape the future with us? Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement. Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

Job Description Job Description At Atom Computing, we build quantum computers using arrays of optically trapped neutral atoms that will empower customers to achieve unprecedented computational breakthroughs. Join a world-class team of scientists, engineers, and business professionals to advance the state-of-the-art in quantum computing. Atom Computing is seeking a hands-on Principal Hardware Engineer with specific expertise in high speed mixed-signal design to lead the architecture, implementation, and deployment of custom electronic assemblies for the control system of our quantum computer. In this role, you will drive hardware strategy across multiple concurrent projects while remaining deeply engaged in the tactical engineering work This position is located in Boulder, Colorado, and will report to the Control Systems Manager. Responsibilities Drive high level system architectures for instruments with partitioning functions across PCBAs, guiding FPGA/control selection, and setting power, clocking, and interconnect strategy Advise or guide technical approach for high-speed mixed-signal front ends, including analog/RF signal chains, DAC and ADC selection, and the noise, linearity, and phase-noise requirements Lead and mentor the team through instrument design, including early brainstorming, simulation, and prototyping, actively participating in schematic and layout design reviews, and collaborating during board bring-up and characterization. Collaborate with quantum engineers and other groups to understand system needs, discuss solutions and define hardware design requirements. Experience & Education BS or MS in Electrical Engineering, Computer Engineering, or a related technical field. 10+ years of relevant postgraduate professional experience in board-level analog and digital circuit design, preferably with Altium Designer. Direct experience designing boards with large, high pin count ICs (FPGAs, processors) with interfaces to high speed communication busses, memory, sophisticated clocking, and high speed analog / RF circuitry Required Qualifications Self-motivated, collaborative, and driven to work effectively in a fast-growing startup environment. Experience teaching and mentoring others in hardware design concepts and process Ability to effectively communicate and collaborate with a diverse team of experimental physicists, hardware, and software engineers. Strong grasp of PCB design best practices across the full design cycle, from concept through fabrication and bring-up and production Mixed signal design experience Demonstrated proficiency with electronic test equipment (e.g., oscilloscopes, spectrum and logic analyzers, signal generators) for the bring-up and debug of prototype electronics assemblies. Preferred Qualifications Familiarity with RF design concepts and/or software defined radio Experience with high speed digital and analog I/O and connector/cable selection and characterization Experience with multi-gigabit serial transceiver lane design, evaluation, equalization Experience with IBIS-AMI modeling and correlation for multi-gigabit serial interfaces Capable in scripting languages (e.g., Python) for basic data acquisition, instrument control, and automating hardware test and characterization. Experience designing high speed memory interfaces Experience working in a Linux environment Familiarity with the MicroTCA, PXIe, or similar pluggable instrument standards Atom Computing provides a wide variety of perks and benefits, including fully paid medical, dental, and vision insurance for our employees and their dependents. Additionally, unlimited paid time off, 401K company matching, short- and long-term disability, FSA, dependent care benefits, and life insurance. We also offer drinks, snacks, and catered team lunches in our offices, every day! The base salary range for this position is between $180,000 - $220,000 annually, commensurate with experience. In addition to salary, we offer an annual bonus and equity in the company. We may use artificial intelligence (AI) tools to support parts of the hiring process, such as reviewing applications, analyzing resumes, or assessing responses and identifying potential inconsistencies or verification signals in application materials based on available information. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.

Job Description Job Description Principal Hardware Engineer, Analog & RF About Mesa Quantum Mesa Quantum is building the manufacturing backbone of the quantum economy. We specialize in chip-scale quantum devices, starting with clocks and sensors, that unlock resilient Position, Navigation, and Timing (PNT) for defense, telecom, space, and critical infrastructure. Our team combines world-class expertise in AMO physics, photonics, microfabrication, and engineering to transform breakthrough science into scalable, deployable technology. Backed by top-tier deep-tech investors and the U.S. Department of Defense, Mesa Quantum is rapidly scaling and actively recruiting exceptional innovators who want to build the future of quantum technology from the ground up. The Role We are hiring a Principal Hardware Engineer to own the board-level control electronics at the core of our chip-scale atomic clock. This is a circuit board design role, not an IC design role: you will take precision analog and RF boards from schematic through layout, bring-up, characterization, and production. You will be the senior hardware engineer on the clock. You own the analog front end, the microwave synthesis chain, the laser drive and thermal control electronics, and the boards that tie them together. You will work daily with our AMO physics, photonics, firmware, and systems teams, and you will set the standard for how Mesa Quantum designs hardware. This is a hands-on principal role. You are expected to personally do the bulk of the circuit and PCB design work, not delegate it. We want an engineer who loves designing circuits, takes pride in clean analog topology and a well-routed board, and would rather be at the bench than in front of slides. Reports to the CTO. Full-time, on-site in Boulder, CO. What You Will Do Design and lay out multi-layer precision analog and RF circuit boards yourself, from schematic capture and simulation through PCB layout, fabrication, bring-up, and debug Own the precision analog front end: photodetector signal conditioning, low-noise transimpedance and instrumentation amplification, and lock-in detection for weak atomic signal recovery Design and validate the microwave synthesis chain that drives atomic interrogation, including PLL and VCO design, phase noise optimization, and reference distribution Design precision VCSEL current drive and thermal control electronics for the laser and physics package Architect successive generations of the control electronics, driving size, power, and noise down at each iteration Build characterization protocols, test fixtures, and automation to validate clock performance against Allan deviation, phase noise, and holdover targets Partner with firmware engineers on the hardware and software interface, and with physicists on the system noise budget Drive Design for Manufacturability and Design for Test with PCB fabricators, assembly houses, and contract manufacturers as we scale toward volume production Set hardware design standards, lead design reviews, and mentor engineers Requirements What You Bring: 10+ years of board-level analog and RF hardware design, including at least one product taken from prototype through volume production A track record of multi-layer boards you personally designed and laid out, mixing sensitive analog, RF, and digital circuits: stack-up definition, controlled impedance, grounding and return-path control, shielding, and thermal management. Be ready to walk us through one in the interview. Current, hands-on proficiency in a professional PCB design tool such as Altium Designer, Cadence Allegro/OrCAD, or KiCad Deep expertise in low-noise precision analog: signal conditioning, low-noise amplifiers, ADC and DAC interfacing, and rigorous noise budgeting RF circuit design through GHz frequencies, with hands-on experience in low phase noise frequency synthesis, PLLs, and VCOs Strong SPICE simulation and circuit analysis skills, including noise, stability, and tolerance analysis Hands-on bench proficiency with oscilloscopes, spectrum and phase noise analyzers, network analyzers, source measure units, and signal generators Scripting experience for instrument control, characterization, and data analysis Version control (Git or similar) for hardware design files Strongly Preferred Chip-scale atomic clocks, rubidium or cesium oscillators, OCXOs, or other precision frequency references Optoelectronics: VCSEL or laser diode drive, photodetector readout, laser frequency locking Embedded firmware in C/C++ on ARM Cortex-M class microcontrollers FPGA development in Verilog or SystemVerilog, including real-time DSP (lock-in detection, PID, digital filtering) Hardware design under hard size, weight, and power budgets Board-level integration of custom mixed-signal silicon, including block specification or characterization Hands-on management of PCB fabricators, assembly houses, and contract manufacturers Defense, aerospace, or space-qualified hardware experience Familiarity with atomic physics or other quantum sensing modalities Experience leading or mentoring a small hardware team Eligibility Due to U.S. Department of Defense funding requirements, applicants must be U.S. persons (U.S. citizens or lawful permanent residents). The ability to obtain and maintain a U.S. security clearance may be required for certain projects. Benefits Base salary of $180,000 to $230,000, based on experience, skills, and demonstrated expertise Meaningful equity in a deep-tech company at the inflection point between prototype and product Comprehensive benefits package Direct ownership of a critical subsystem with measurable impact on a product that matters to U.S. national security A team that includes deep AMO physics, RF, photonics, and microfabrication expertise Boulder location with access to Colorado's strongest tech and outdoor communities

Job Description Job Description About Astera Astera is a private foundation on a mission to steer science and technology toward a better future. We believe the coming years will bring an era of unprecedented scientific and technological advancement as exponential progress in AI converges with central advances in other fields to accelerate innovation. This inflection point provides an unparalleled opportunity to fundamentally rethink the institutions, systems, and tools that drive progress. We have committed a $3.5B endowment to that work and fit the form of our support to the function it serves: grants, investments, and in-house research programs. We accept meaningful risk in the research we back and expect some of it to fail because transformative ideas are rarely the ones already proven. Our projects, and the foundation itself, operate like high-velocity startups, with a high performance bar and competitive compensation to match. We are searching for leaders who are compelled by the challenge of driving high-impact change in the way science is funded, conducted, and communicated. You can read more about our mission, vision, and programming at astera.org/vision. About Astera Neuro Astera Neuro seeks to understand and engineer consciousness. We believe consciousness is the process by which the brain builds a coherent internal model of the world and the self. We aim to understand this model and to develop the technologies to write experience directly into the brain. By combining large-scale neural recording, causal perturbation, and brain-based AI, we seek to move neuroscience from observing correlates of experience to engineering it. The same tools carry direct therapeutic promise for neurological and psychiatric diseases that alter perception, thought, and sense of self. Because the science and tools required do not yet exist, we are assembling a founding team of neuroscientists, theorists, and engineers to create them. We do high-risk, high-reward science in a well-resourced, collaborative environment with competitive pay, and share everything openly under Astera's Open Science Policy. Position Summary Working closely with our experimental, surgical, and software teams, probe engineers here design and build the recording hardware - the probes, insertion mechanisms, and robotics that determine how much of the brain we can see, and how well. The role spans three tightly coupled problems: the probe (thin, flexible, high-density electrode arrays), the needle (the micro-machined tool that carries a probe past the meninges without damaging it or the tissue), and the robot (the precision system that places many probes quickly, accurately, and repeatedly while avoiding vasculature). You will move fluidly across mechanical design, microfabrication, and control, and you will own hardware from initial concept through benchtop validation and into the recording rig. We are hiring at multiple levels. As an Engineer, you will lead well-defined hardware projects with regular guidance. As a Senior Engineer, you will own hardware lines end-to-end, drive design decisions, and set fabrication and test strategy. As a Principal Engineer, you will define the probe and robotics roadmap, mentor engineers, and shape how mechanical, fabrication, and control work fit together at Astera. We will calibrate scope and title to your experience. What You'll Do Design flexible, high-density neural probes; thin-film polymer arrays (polyimide, Parylene C, or comparable) patterned with hundreds to thousands of microelectrodes, from layout through fabrication and encapsulation. Build probe-to-chip integration and the readout signal chain, bonding high-density electrode arrays to amplifier and acquisition electronics, and developing the low-noise front-end that amplifies, digitizes, and streams microvolt neural signals to the acquisition system. Design insertion needles and needle-pincher mechanisms; micro-machined and electrochemically etched tools that grasp, insert, and release flexible probes at micron-scale placement accuracy. Develop insertion strategies that solve the hard mechanics of putting a flexible thread into soft tissue; managing bending stiffness and buckling, temporarily stiffening the probe for insertion, and mitigating the forces that build up across many closely spaced insertions. Build a precision insertion robot; multi-axis motion, servo and linear-motor drives, and the real-time control that makes placement fast, accurate, and repeatable. Develop machine-vision guidance for the robot; imaging and computer vision that locate targets, guide the needle to them, and avoid surface vasculature during insertion. Build electrode characterization and process pipelines, impedance and electrochemistry (e.g., Pt, PEDOT coatings), yield, and reliability testing that turn a working prototype into a manufacturable part. Who You Are Required: Strong hands-on engineering across mechanical design and prototyping; you move fluently between CAD, the machine shop, and the benchtop. Experience building precision electromechanical or robotic systems (multi-axis motion, servo/linear-motor control, tight tolerance stacks). Familiarity with microfabrication and thin-film processes (photolithography, deposition, etching, cleanroom work), or a demonstrated ability to pick them up fast. Comfort with real-time control and the software that drives hardware (Python plus C/C++ or comparable; embedded, FPGA, or RTOS a plus). Working knowledge of the signal-acquisition chain - how low-level analog signals are amplified, digitized, and acquired - and comfort collaborating with electronics engineers on it. Genuine interest in building instruments for neuroscience, and in the tissue-mechanics constraints that make this problem hard. Preferred/Nice to Have: Flexible/thin-film electrode microfabrication (polyimide, Parylene C, PDMS) and electrode electrochemistry. Micro-machining and electrochemical etching of fine metal tooling (e.g., tungsten, tungsten-rhenium). Low-noise analog/mixed-signal front-end design for recording microvolt-scale signals (amplification, filtering, multiplexing, digitization). High-density interconnect and packaging; bonding fine-pitch electrode arrays to electronics (e.g., flip-chip, wire bonding, ACF, or comparable). Precision motion control, machine vision, or real-time closed-loop robotics. Surgical or medical-device hardware, including sterilization, sterile workflow, and design under regulatory constraints. Neural interfaces, MEMS sensors, or other implantable devices. Contributions to open-source hardware, instrumentation, or scientific-computing projects. Additionally Expected at Senior / Principal Level A track record of taking hardware from concept to working, validated device; owning design tradeoffs, fabrication, and test. Experience making and defending tradeoffs across precision, reliability, manufacturability, and biocompatibility. Comfort working across the stack, from mechanical design and fabrication to control software and system integration. A history of mentoring engineers or leading technical initiatives (Principal level). Education PhD with 3 to 12+ years of experience. Backgrounds in mechanical, electrical, biomedical, or materials engineering, mechatronics, robotics, applied physics, MEMS/microfabrication, or related fields are all welcome. Graduate work or research experience is a plus but not required. We value demonstrated skill and relevant experience above credentials. Compensation The posted salary range is based on location in the Bay Area. The successful candidate will receive a competitive compensation package, commensurate with their experience and location. Why Join Us Astera Neuro is hiring a probe engineer to design the flexible neural probes, insertion needles, and precision robotics that make large-scale recording possible: devices that place thousands of electrodes with micron precision while sparing the tissue around them. If you want to build the physical instrument at the heart of a new neuroscience, let's talk. Astera Neuro provides a comprehensive benefits package and total compensation that is competitive and commensurate with the level of experience and qualifications. We are an equal opportunity employer and value diversity and inclusion! Compensation Range: $200K - $350K

Job Description Job Description Principal Test Engineer JOB DESCRIPTION Job Title: Principal Test Engineer Job Code: 12663 Reports To: Manager/Director of Engineering Department Name: 40 - Test Engineering Location: Wichita POSITION SUMMARY (Briefly describe the purpose of the position ) Plan, design and evaluate test development projects in collaboration with internal and external customers to ensure that all specifications meet customer expectations and organizational requirements. Must have experience with memory testing. Position is located in Wichita, KS. Please do not apply if you are not interested in relocation. ITAR Compliance is required. You must be a US Citizens or Green Card holder to be considered for position. KEY RESPONSIBILITIES/ESSENTIAL FUNCTIONS INCLUDE (List in order of importance ) Develop semiconductor component-level test plans that determine methods, procedures, and conditions to ensure coverage of device specifications that meet customer application requirements. Develop Automated Test Equipment (ATE) test program hardware and software to test semiconductor devices per customer approved test plans. Configure and/or program bench level lab equipment as needed to meet test requirements. Work with the Sales Team to accurately cost quote device test development engineering hours, test platform hours, and the test hardware required to meet customer approved test plans. Work with the Operations Team to determine engineering feasibility and cost effectiveness for production-level test programs. Resolve technical problems using device/test debugging technics, and collection of test characterization data to reach engineering conclusions for driving corrective actions. Flexibility to perform other duties as assigned. JOB REQUIREMENTS INCLUDE (List as required or preferred ) Education: Bachelor's degree in Electrical Engineering preferred; however, a combination of education and experience wherein the skills and abilities to perform the responsibilities and functions have been adequately demonstrated is acceptable. Experience: 7-10 years of the following experience is required: Developing IC test solutions on automated test equipment such as Teradyne, Advantest, LTX-Credence, etc. platforms. Test program development of digital, analog or mixed signal integrated circuits. Utilize knowledge of programming techniques, electronic, test equipment, and test specifications to develop test programs to a set schedule. Read, analyze, and interpret semiconductor datasheets and test specifications to estimate test program development time and material costs. Program manage individual test developments from initial stage to completion while accurately reporting status to all stakeholders. Maintain a high level of attention to detail and accuracy to ensure data integrity. Utilize effective communication skills with internal and external customers to achieve required results. Effectively and efficiently utilize Microsoft Office and other computer products and programs. Knowledge/Skills/Overall Competences: Job Knowledge: Possesses and applies a comprehensive knowledge of a particular field of specialization to the completion of significant assignments. Comprehensive knowledge of products and product direction for all products. Level at which career may plateau. Technical Skill Having wide-ranging experience, uses professional concepts and company objectives to resolve significantly complex issues in creative and effective ways. Applies extensive expertise as a specialist to accomplish goals. Leads product design projects. An emerging authority in a particular field. Design/Planning: Task Definition, Design, Project Planning Understands company technical goals and direction and influences how it applies to work in the function. Accurately estimates time and resources necessary for projects. Coaches and leads others in the use of process and planning tools. Job Complexity Works on significant and complex issues where analysis of situations or data requires an in-depth evaluation of variable factors. Exercises independent judgment in selecting methods, techniques and evaluation criteria for obtaining results. Complexity of work requires ingenuity and creativity to solve problems and accomplish goals. Creates formal networks involving coordination among internal groups. Problem Resolution Identifies and resolves problems and issues outside of the assigned area. Develops solutions to complex problems that require the regular use of ingenuity and creativity. Serves as a mentor or consultant to others in solving problems or thinking through issues. Communication: Verbal/Written Consistently communicates effectively across organizational boundaries and externally to customers. Involved in cross-department projects in defining or solving problems. Interacts to share knowledge and solutions and to lead/serve on task teams or committees. Teamwork Leads others in gaining a common understanding through discussion. Clarifies team goals, expectations, ground rules and responsibilities. Makes progress even when ambiguity has not been resolved. Personal Leadership: Influencing, Impact, Affecting Change, Coaching Establishes product direction in related areas. Makes decisions that affect income, expenses, operations and customer relations that in turn directly influence activities and objectives of cross functional work groups or function. Sound decisions or recommendations result in successfully achieving critical company objectives and affect the image of the organization's technological capability. Effective in gaining buy-in. Coach/Develop others in many related areas. Supervision Required Duties are performed under minimal supervision with assignments given in terms of objectives and results expected. Operates with substantial latitude for un-reviewed actions or decisions. Determines methods and procedures on new assignments and may lead activities of other personal

Job Description Job Description Company Description Renesas is a global semiconductor company delivering innovative embedded processing, analog, power, and connectivity solutions. This role supports advanced power management products for demanding compute, AI, datacenter, and infrastructure applications. Job Description Renesas is seeking an experienced Principal Digital Engineer to define scalable verification and validation methodologies for advanced digital power management products used in AI, datacenter, and high-performance computing applications. This role focuses on the system-level verification layer that connects analog behavior, digital implementation, firmware interaction, software tooling, validation data, and customer-facing performance. The successful candidate will help define what must be proven, how it should be measured, and how results should be correlated across models, simulation, emulation, bench validation, and silicon. The ideal candidate combines mixed-signal engineering depth with verification strategy, automation mindset, and the ability to align cross-functional teams around clear, repeatable evidence. WHY THIS ROLE MATTERS Define verification strategy for complex mixed-signal power management systems. Improve confidence in architecture decisions by connecting requirements, models, tests, and measured data. Help execution teams converge faster by turning expert validation knowledge into reusable verification patterns. KEY RESPONSIBILITIES Define mixed-signal verification strategy for digital power controllers and related power management products. Develop system-level verification plans covering sensing paths, ADC/DAC behavior, PWM paths, telemetry, compensation, control-loop behavior, latency, quantization, noise, limits, sequencing, and corner behavior. Establish correlation methodologies across behavioral models, RTL, analog/mixed-signal simulations, emulation, bench validation, and silicon measurements where applicable. Define measurable pass/fail criteria, coverage expectations, reference scenarios, and evidence requirements for architecture and product decisions. Collaborate with systems, analog design, digital design, firmware, design verification, validation, applications, and software/tool teams. Support automation of verification results, including consistent metrics, plots, waveforms, summaries, and structured outputs for engineering review. Identify verification gaps early and help teams close ambiguity between system intent, implementation behavior, and validation evidence. Document verification methodology, interface assumptions, test intent, correlation expectations, and residual risks clearly for technical and leadership audiences. Qualifications Bachelor's degree in Electrical Engineering, Computer Engineering, or a related technical discipline. 8+ years of experience in mixed-signal verification, semiconductor validation, systems engineering, analog/mixed-signal design, design verification, or related product development. Strong understanding of analog and mixed-signal building blocks such as ADCs, DACs, amplifiers, references, sensing paths, timing circuits, PWM paths, or power stages. Experience defining verification plans, validation methodologies, measurable results, and technical evidence for complex electronic systems. Ability to work across analog, digital, firmware, validation, applications, and software/tool teams. Strong communication skills and ability to explain complex cross-domain verification issues clearly. PREFERRED QUALIFICATIONS Experience with digital multiphase controllers, DC/DC converters, voltage regulators, power management ICs, or high-current datacenter power applications. Experience with model-to-silicon correlation, behavioral modeling, real-number modeling, Verilog-AMS, SystemVerilog RNM, MATLAB, Python, SIMPLIS, or equivalent environments. Experience with verification automation, data analysis, test infrastructure, dashboards, databases, or API-driven workflows. Familiarity with control loops, stability, latency, quantization, noise, telemetry, and power-system measurement techniques. Experience creating reusable verification frameworks that improve quality and reduce repeated manual test setup. Additional Information Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives. We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Are you ready to join our team and shape the future with us? Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement. Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

Job Description Job Description Principal Analog/Mixed Signal Engineer Company: Extropic Location: Boston, MA (hybrid, 3 days in office) Compensation: $200,000 - $325,000 + competitive equity Employment Type: Full-time Visa Sponsorship: Visa transfers and new sponsorship (H-1B, TN) About Extropic Extropic is building thermodynamic computing, a new compute paradigm that uses thermal noise in CMOS devices to perform probabilistic computation with radical power efficiency (potentially 10,000x savings over traditional approaches). Its founders, former Google Quantum Computing researchers, spent years fighting thermal noise before realizing they could harness it. Founded in 2022, Extropic has about 30 people, has taped out its third chip (Z1) and is defining the architecture for three more. It has raised a $14.1M seed. The Role Extropic is hiring a Principal Analog/Mixed Signal Engineer (6+ years) to lead the design of next-generation thermodynamic computing chips. This is a ground-floor chance to own major pieces of chip design, and potentially serve as design lead for one of three planned chips, at a company positioned to reshape AI acceleration and edge computing. What You Will Do Lead design of analog and mixed-signal blocks: ADCs, PLLs, bandgaps, regulators, high-speed SerDes, oscillators and dividers. Own large parts of chip architecture, potentially as design lead for an upcoming chip. Do hands-on layout and design verification (DRC, ERC, LVS). Work across IC, systems, physics and algorithms teams to turn probabilistic computing concepts into silicon. Test and validate fabricated chips in the lab with signal generators, spectrum analyzers and oscilloscopes. What You Bring 6+ years of analog/mixed-signal IC design Block design experience (ADCs, PLLs, SerDes, bandgaps, regulators) Hands-on layout and verification (DRC, ERC, LVS) in Cadence CMOS and FinFET process experience Lab bring-up and validation skills Ability to work hybrid 3 days a week in Boston Tech Stack CMOS, Cadence, FinFET, PLL, ADC, SerDes, Python, C